The core of the SC-350 is a versatile process chamber designed for both established standard applications such as vacuum reflow soldering and future innovative processes. It is equipped with a powerful automation platform and uses a forward-looking software architecture that supports smart manufacturing and IoT applications.

• Precise control of process parameters
• Ideal for high-volume production and flexible adjustments
• Unlimited functionality
• Maximum flexibility for research, development and mass production
• IoT connectivity
• Worldwide support with minimal operating costs and certified IT security

With the SC series, REK Innovation presents a new generation of intelligent process chambers that combine research flexibility with the performance and reliability required for continuous operation.

• Working area: 400 × 350 × 70 mm
• Maximum temperature: Up to 1000°C
• Vacuum capability: High-vacuum processes for maximum purity
• Gas processing: Adjustable atmospheres for inert and reactive gases (including formic acid for fluxless soldering)

The SC-350 supports both contact-based and contactless heat transfer, enabling a wide range of applications such as processing power electronics on DBC or AMB substrates.

• Independent heating and cooling control – extremely fast temperature changes, independent of pressure and gas composition
• Highest efficiency – short cycle times for maximum productivity

Vacuum reflow ovens are mainly used for applications where void-free soldering is essential:

• Power electronics: Attaching dies to substrates (such as DBC or AMB) in IGBT modules where high reliability and efficient heat dissipation are required.
• LED manufacturing: Ensures void-free connections in LED modules for improved thermal performance.
• Advanced PCBs: For highly reliable printed circuit boards with complex layer stacks and components.
• Die attach: One of the most common applications of vacuum reflow soldering systems. Typically, bare dies such as IGBT, power or laser diodes, MEMS, etc. are placed on a substrate, leadframe or other semiconductor package.
• Substrate soldering: Large-area soldering of DBC and AMB substrates is a highly demanding process for vacuum reflow systems.
• Hermetic sealing: To protect electronic devices from environmental influences, they are often sealed in ceramic or metallic housings.
• T/R modules: Highly reliable solder joints are essential for manufacturing high-frequency devices in various space, air and ground applications.
• Wafer bump reflow: Solder and pillar bumps made from many different materials are used in flip-chip and wafer-level soldering.
• Wafer level packaging (WLP): Enables extreme miniaturization of package form factors and reduction of cost per device.
• Brazing: High-melting-point solders based on silver or glass can be used to join parts made of stainless steel, Kovar®, ceramics, etc.
• Other thermal processes: Annealing, sintering and alloying at substrate or wafer level can be applied to modify material composition and chemical/physical properties.

In addition to state-of-the-art system technology, REK Innovation offers a comprehensive service portfolio that supports customers in process development and optimization.

• Technology and process consulting – support from research to series production
• Training & maintenance – maximum system availability and productivity
• Repairs & spare parts – fast supply for uninterrupted operation
• Upgrades & updates – future-proof expansion of the SC series

• Maximum precision & reliability – perfect for high-tech production
• Automation & user-friendliness – intuitive operation for highest efficiency
• Made in Germany – quality you can rely on
• Worldwide support – fast assistance through our global service network