News from REK Innovation

Participation in LOET 2025 in Aachen

The 14th International Conference on Soldering, High-Temperature Soldering, and Diffusion Bonding will take place from June 24–26, 2025, in Aachen. This conference is among the world’s leading events in this field.

Published on: March 24, 2025

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LOET 2025 Conference

SMC and REK Innovation – Strong Together

Vacuum soldering of electronic components places high demands on valve technology. A joint project between SMC and REK Innovation demonstrates how reliable operation of vacuum reflow soldering systems can be achieved.

Published on: June 18, 2024

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SMC Partnership